The improvements in networking and modern-day communications have brought about the demand for bulk transfer of voice and data from one point separated from another by almost 50-100 miles. While the conventional wire-connected networks had great bandwidth, they involved the complex task of the stretching physical wires over great distances. In wireless data backhaul, data packets can be sent to distances as far as 50 miles at a speed ranging from 1Mbps to 2Gbps. Cellular operators have played an important role in this new emerging market of wireless data backhauling. The emergence of 3G services has provided biggest market boost, as these services provide organizations huge bandwidth for transferring data from one location to another.

The growing trend of globalization has been a pivotal factor in the market growth of telecommunications; and thus acts as a market driver for wireless data transfer and the wireless backhaul market as well. The economic growth of developing nations and the spread of internet and mobile communications in these regions have opened up new markets for wireless backhauling. The market is set for a huge growth as wireless backhaul is expected to become a mainstream technology for data transfer within the next five years.

The global wireless and mobile backhaul equipment market is expected to be worth US$38.0 billion by 2014, growing at an estimated CAGR of 18.7% from 2009 to 2014. Microwave forms the largest market segment and is expected to reach a size of US$16.5 billion by 2014. Asia is the largest wireless backhaul market; and is expected to be worth US$12.2 billion by 2014, accounting for nearly 32% of the total revenues. The Asian wireless backhaul market also has the highest CAGR of 21.8%.

Scope of the Report

This report aims to identify and analyze Global Wireless and Mobile Backhaul Equipment Market according to applications, technologies, and topologies. The report provides in-depth market estimates and forecasts for Global Wireless and Mobile Backhaul Equipment Market as follows:

•Wireless and Mobile Backhaul Equipment Market– Technologies: TDM & ATM, microwave, pseudowire, free space optics, satellite, All-IP RAN
•Wireless and Mobile Backhaul Equipment Market– Application: Voice/data backhaul between cellular towers, broadband backhaul connectivity, building-to-building connectivity, video surveillance backhaul
•Wireless and Mobile Backhaul Equipment Market– Topologies: Point to Point (PTP) configurations, Point to Multipoint (PTM) configurations, wireline bridging and extension
Each section will provide market data, market drivers, trends and opportunities, top-selling products, key players, and competitive outlook. This report will also provide various market tables for different geographic regions covering the sub-segments and micro-markets. In addition, the report also provides 40 company profiles for each of its sub-segments.

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Base band, the core of mobile phone platform, is also the key component of a mobile phone.

The year of 2009 will witness the prosperity of smart phone. With the increasing enhancement of hardware performance, a mobile phone will be more like a PC. In addition, as 3G arrivies, the mobile phone is marching into the mobile internet era, which indicates that more and more mobile phones will have open operating system and the function of full web browsing. Meanwhile, the success of IPhone has promoted more PC manufacturers focus on smart phones.

During the world’s communication industry conference on Feb 16 2009, Acer announced eight new smart phone models, and the revenue from those eight models are expected to account for 10% of Acer’s total revenue in the next three years, which is about US $2billion. Moreover, Dell will also launch its own smart phone by the end of Feb 2009, Toshiba and HP will also tend to enlarge their smart phone investments.

Mobile phone platform manufacturers certainly have made more efforts on smart phone platform developments. In the middle of Feb, 2009, MediaTek announced its launch of MT6253, its first GSM/GPRS smart phone chip, which integrates the basic components like DBB, ABB, PM, and RF Transceiver, it also supports abundant multimedia functions such as camera, high speed USB and Class D audio power amplifier. Not like ASIC, the SiP packaging has made the success of such a high-integrated IC in a short term.

MT6516, another smart phone solution simultaneously launched by MediaTek, which supports WVGA LCD resolution, MPEG-2 decoding, and mobile phone TV application standards like CMMB, DVB-T, and DVB-H, by the integration of various video codec. And no doubt that MediaTek supports Windows Mobile.

Although it has been adopted by many smart phone manufacturers, Qualcomm’s MSM72XX series was not originally designed for smart phone. In order to expand the smart phone market, Qualcomm launched the dramatically SNAPDRAGON platform focus on smart phones. So far, it has been adopted by Toshiba and HTC. Moreover, its CPU and DSP speed can respectively reach 1GHz and 600MHz, moreover, it supports WLAN, GPS, 12 million-pixel camer and mobile phone TV (including ISDB-T and DVB-H)

Marvell, the new entrant, it had acquired INTEL’s mobile phone communication division at the cost of US $600 million in 2006. Originated from XScale technology, Marvell’s PXA processor series achieved a great performance in the high-end smart phone sector. Marvell had divided into two routes in 2008, one was PXA930, integrating application processor and 3G Modem; the other was application processor, including PXA310, PXA312, PXA320 and PXA168.

However, there are two sides regarding smart phones, one side insists to separate application processor and base band processor, while the other side claims to the integration. Apple, Nokia and Japanese manufacturers are supporting the former, while Sony Ericsson, Acer, HTC, BlackBerry, MOTO, Samsung and LC are for the other side. It also the main reason why Infineon, TI, ST, and NXP do not launch single-chip smart phone base band, because they are also the supporters of Apple, Nokia and Japanese Manufacturers.

Two big events had taken place in global mobile phone platform industry in 2008, one was mobile phone business integration of ST, NXP and Ericsson mobile phone platform (EMP), and the other was TI quits the general base band market.

In Apr, 2008, ST and NXP wireless division co-established a new company, which started its operation in the beginning of Aug, 2008. Then the new company starts to remerge the EMP (the revenue of EMP was US $500 million in 2007FY), and the merger is expected to complete in 2009Q2. NXP, ST and EMP are respectively good at DSP operation and radio frequency, radio frequency and analog, and communication Modem.

TI had made significant adjustments to its mobile phone base band strategy on Oct 20, 2008. It planned to sell its general mobile phone base band division, which could save approximately US $200 million expenditure each year, but it still maintained the division producing custom base band for manufacturers like Nokia. The main products of TI’s general mobile phone base band division were LoCosto and eCosto, and the annual revenue of this division only accounted for 10% of TI’s total wireless revenue in 2008, while the proportion for the custom base band division was 65%. It is expected the general mobile phone base band division will be sold out in 2009Q2; otherwise, TI will shut it up. However, TI will enlarge investment in custom base band sector, to compete with ST rather than quit.

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In 1H2008, China exported about 248 million mobile phones, which valued US$17.4 billion. In 2H2008, approximately 285 million mobile phones were exported with the value of US$21.1 billion. Therefore, China exported 533 million mobile phones valued US$38.5 billion totally in 2008, with the average export price of US$72. During the first half of 2009, China exported 237 million mobile phones valued US$16.1 billion, and imported 11.74 million ones; besides, the output of mobile phone was 305 million in China.

BYD, Samsung, ZTE and LG gained high growth rate, particularly Samsung with the highest rate. Among them, the shipment of Samsung’s Huizhou Plant was almost three times over that in 2008. ZTE obtained large shares in the new telecoms procurement. Since its increasing global shipment, LG increased the output in China, but the majority of increment was entrusted to Taiwan Arima. Benefiting from Nokia’s modest preferential policies, the shipment of BYD rose greatly. In contrast, the growth rate of Foxconn, Motorola, Huawei and Compal declined sharply. The shipment of Foxconn decreased because BYD competed with it for orders and its major clients Motorola and Nokia has less demand. Huawei tried to sell mobile phone business in the second half of 2008, but failed to do it at the end of 2008, so Huawei’s mobile phone business stalled in the second half of 2008 and run unfavorably in the first half of 2009. The remaining manufacturers had little changes.

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CMMB industry chain involved the CMMB chip, CMMB operation, CMMB terminal, etc. By Jan 2009, the quantity of CMMB chip manufacturers in China has amounted to eight, including Innofidei, Telepath, Spreadtrum, Siano, Smartchip Integration, Institute of Microelectronics of Chinese Academy of Sciences, Rockchips and Iped, of which, Innofidei matches MTK platform, with high price; Spreadtrum targets on TD+CMMB market; due to its self-development, the Israel-based manufacturer of Siano advantaged at price.

By Jan 2009, CMMB terminal mainly focused on the mobile handset, PMP and GPS, of which, mobile handset shared over 60% of the market sales. The key CMMB mobile handset manufacturers includ ZTE, K-Touch, Lenovo, etc, the key CMMB PMP manufacturers includ Aigo, Ramos, etc, and the key CMMB GPS manufacturers includ Shinco, AOCOS, CECT, etc.

The report is focused on the market scale, development trends and key players of CMMB chip, CMMB operation, CMMB module and CMMB terminal products.

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